3D TSV and 2.5D Market is expected to grow at a CAGR of 32% to 34% from 2020 to 2025 – An exclusive market research report by Lucintel
Lucintel’s latest market report analyzed that 3D TSV and 2.5D provides attractive opportunities in the consumer electronics, automotive, high-performance computing and networking industries. The 3D TSV and 2.5D market is expected to grow at a CAGR of 32% to 34%. In this market, CIS with TSV is the largest segment by packaging type, whereas consumer electronics is largest by end use industy.
Download Brochure of this report by clicking on https://www.lucintel.com/3d-tsv-and-2.5d-market.aspx Based on packaging type, the 3D TSV and 2.5D market is segmented into 3D stacked memory, 2.5D interposer, CIS with TSV, 3D SoC, and Others. The CIS with TSV segment accounted for the largest share of the market in 2020 and is expected to register the highest CAGR during the forecast period, due to the growth of the smartphones and is increasingly integrated into the high-end market segment for memory devices.
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The 3D TSV and 2.5D Market is marked by the presence of several big and small players. Some of the prominent players offering 3D TSV and 2.5D include Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Toshiba, ASE Group, and Amkor Technology
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link firstname.lastname@example.org.
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